Indium Corporation of America

Patent Owner

Watch Compare Add to Portfolio

Stats

Details

Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 786
 
  
 
C22C ALLOYS 567
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 2360
 
  
 
F28F DETAILS OF HEAT-EXCHANGE OR HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION 151
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 1155

Top Patents (by citation)

Upgrade to the Professional Level to View Top Patents for this Owner. Learn More

Recent Publications

  • No Recent Publications to Display

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9260768 Lead-free solder alloys and solder joints thereof with improved drop impact resistanceDec 06, 06Feb 16, 16[C22C]
7749336 Technique for increasing the compliance of tin-indium soldersFeb 24, 06Jul 06, 10[C22C]
7749340 Technique for increasing the compliance of lead-free solders containing silverOct 18, 06Jul 06, 10[C23C, B23K, C22C]
7635076 Method for fabricating large dimension bonds using reactive multilayer joiningFeb 11, 08Dec 22, 09[B23K]
7593228 Technique for forming a thermally conductive interface with patterned metal foilOct 25, 06Sep 22, 09[H01L, F28F, H05K]
7017795 Solder pastes for providing high elasticity, low rigidity solder jointsOct 01, 04Mar 28, 06[B23K]
6783057 Anti-tombstoning solder alloys for surface mount applicationsSep 20, 01Aug 31, 04[B23K]
6677179 Method of applying no-flow underfillNov 16, 01Jan 13, 04[H01L]
6610559 Integrated void-free process for assembling a solder bumped chipNov 16, 01Aug 26, 03[H01L]
5957364 Integrated solder preform array having a tin outer coatingJun 10, 96Sep 28, 99[B23K]

View all patents..

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2007/0256,761 ALLOY COMPOSITIONS AND TECHNIQUES FOR REDUCING INTERMETALLIC COMPOUND THICKNESS AND OXIDATION OF METALS AND ALLOYSAbandonedMay 08, 07Nov 08, 07[C22C]
2007/0071,634 LOW MELTING TEMPERATURE COMPLIANT SOLDERSAbandonedJun 07, 06Mar 29, 07[C22C]
2005/0100,474 Anti-tombstoning lead free alloys for surface mount reflow solderingAbandonedSep 08, 04May 12, 05[C22C]
2005/0028,361 Integrated underfill process for bumped chip assemblyAbandonedAug 07, 03Feb 10, 05[H05K]
6059900 Lead-based solders for high temperature applicationsExpiredFeb 18, 98May 09, 00[C22C]
5600102 Solder preform wrappable around a printed circuit card edgeExpiredFeb 27, 96Feb 04, 97[H05K]
5455004 Lead-free alloy containing tin, zinc, indium and bismuthExpiredJun 22, 94Oct 03, 95[C22C]
5248476 Fusible alloy containing bismuth, indium, lead, tin and galliumExpiredApr 30, 92Sep 28, 93[C22C]
5242658 Lead-free alloy containing tin, zinc and indiumExpiredJul 07, 92Sep 07, 93[C22C]
5108497 Treatment of indium dustsExpiredSep 05, 90Apr 28, 92[C22B]
4968550 Wire braid reinforced indiumExpiredApr 20, 89Nov 06, 90[B32B]
4828608 Process for ultrapurification of indiumExpiredMay 14, 87May 09, 89[C22B, C22C]
4620661 Corrosion resistant lid for semiconductor packageExpiredApr 22, 85Nov 04, 86[H01L]

Top Inventors for This Owner

Upgrade to the Professional Level to View Top Inventors for this Owner. Learn More

We are sorry but your current selection exceeds the maximum number of comparisons () for this membership level. Upgrade to our Level for up to -1 comparisons!

We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level. Upgrade to our Level for up to -1 portfolios!.